Xilinx Virtex® UltraScale+™现场可编程阵列具有多种功率选项，可在所需的系统性能和极低功耗之间实现最佳平衡。FPGA是半导体器件，基于通过可编程互连系统连接的可配置逻辑块 (CLB) 矩阵。Virtex UltraScale+器件在FinFET节点上提供极高性能和集成功能。与7系列FPGA相比，这些器件的系统级性能功耗比提升3倍多。Virtex UltraScale+器件非常适合用于从1+Tb/s网络、智能网络接口控制器、机器学习和数据中心互连到完全集成的雷达/预警系统的各种应用。这些器件在UltraScale架构中实现了极高的收发器带宽、数字信号处理能力以及片上和封装内内存。
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特性
可编程系统集成
封装内集成了高达8GB的HBM Gen2
高达500Mb的片上存储器集成
集成100G以太网MAC，支持KR4-FEC及150G Interlaken内核
面向PCI Express Gen 3x16的集成模块
提升系统性能
与Virtex-7 FPGA相比，系统级性能功耗比提升2倍多
高利用率使速度提升四个等级
高达128-33G的收发器可提供8.4TB的串行带宽
采用KP4-FEC的58G PAM4收发器可实现50G+线路速率的数据传输
中等速度等级支持460GB/s HBM带宽和2,666Mb/s DDR4
降低了BOM成本
1Tb MuxSAR转发器卡减少比例为5:1
适用于片上存储器集成的UltraRAM
VCXO与fPLL（分频锁相环）的集成可降低时钟元件成本
降低了总功耗
与7系列FPGA相比，功耗降低60%
电压缩放选项支持高性能与低功耗
采用紧密型逻辑单元封装，降低了动态功耗
提高了设计生产力
从20nm平面到16nm FinFET+的无缝占位迁移
与Vivado Design Suite协同优化，加快设计收敛
适用于智能IP集成的SmartConnect技术
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